Process | Ability and accuracy | |
Photoresist coating | Spin coating | Glue thickness accuracy≤3% (Applicable to plane) |
| Photoresist coating | Spin coating | Glue thickness accuracy ≤10% (Suitable for flat/concave surface) |
Photolithography | Accuracy 2um Registration accuracy: 0.15um | |
Development | Accuracy 2um Development uniformity <5% | |
Etching | Size dispersion ±1um | |
