| Parameter | TGV Standard Specification |
| Material | Glass, Fused Silica etc. |
| Wafer Size | 4”, 6”, 8”, 12” etc. |
| Mini. THK. | 0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”) |
| Mini. Dia. Via | 20μm |
| Taper | 3~8° |
| Pitch | 50μm, 100μm, 150μm etc. |
| Max. Aspect Ratio | 1:10 |
| Metallization | AR film, Reflection film, Splitter film etc. |
* Remark：Customized is available | |
