Through Glass Via(TGV)

Standard Specification

Parameter TGV Standard Specification
Material Glass, Fused Silica etc.
Wafer Size 4”, 6”, 8”, 12” etc.
Mini. THK. 0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”)
Mini. Dia. Via 20μm
Taper 3~8°
Pitch 50μm, 100μm, 150μm etc.
Max. Aspect Ratio 1:10
Metallization Available

* Remark:Customized is available


Parameter TGV Standard Specification
Material Glass, Fused Silica etc.
Wafer Size 4”, 6”, 8”, 12” etc.
Mini. THK. 0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”)
Mini. Dia. Via 20μm
Taper 3~8°
Pitch 50μm, 100μm, 150μm etc.
Max. Aspect Ratio 1:10
Metallization Available

* Remark:Customized is available


Application

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